Tag: SMT Hybrid Packaging

SMT Hybrid Packaging Conference 2018 Recap

SMT Hybrid Packaging Logo

Photo: © 2018 Mesago/Mathias Kutt

With more than 430 exhibitors, all presenting new innovations and solutions for microelectronic assemblies and systems, the SMT Hybrid Packaging Conference is one of the largest trade shows in the industry. From June 5 to June 7, global contributors in microelectronics gathered in Nuremburg, Germany to display their advanced products and technologies. Among those exhibitors was Advantek, a recognized leader in manufacturing precision component delivery systems.

This year’s SMT conference was a great platform for Advantek to display new products and solutions to customers from around the world. High precision developments and Advantek’s most recent design enhancements for complex tapes were a standout at the trade show, drawing new customers and downstream users.

Photo: Axel Held

SMT 2018 proved that the positive developments from last year’s conference are advancing, and the interest in precision component delivery systems continues to grow.

“The detailed discussions we had with customers and industry partners on a wide array of products and new innovations will continue to expand our role as the leading solutions provider throughout Europe.”  said Axel Held, Director Sales EMEA at Advantek.

SMT Hybrid Packaging Conference – 2018 (Voucher Redemption)

Smthybridpackaging logo

Advantek will exhibit at the SMT Hybrid Packaging Conference in Nuremberg, Germany on 5-7 June 2018.

If you received a show voucher from Advantek, please click the link at the bottom of this announcement for your registration to SMT Hybrid Packaging 2018. Visit us at booth 226 in hall 4 to learn more about our advanced line of carrier tape, including high precision tape for bare die, cover tape, reels, and more. If you would like to receive a voucher, please contact your Advantek sales office.

Reedem Voucher

SMT Hybrid Packaging Conference – 2018

Smthybridpackaging logo

Advantek will exhibit at the SMT Hybrid Packaging Conference in Nuremberg, Germany on 5-7 June 2018.

Come join us alongside some of the world’s leading experts in electronic manufacturing to discuss current trends and solutions in the industry. Visit us at booth 226 in hall 4 to learn more about our advanced line of carrier tape, including high precision tape for bare die, cover tape, reels, and more.

To learn more about SMT 2018, visit here.

SMT Hybrid Packaging 2016

SMT Hybrid Packaging 2016

Advantek will exhibit at the SMT Hybrid Packaging Conference in Nuremberg, Germany on 26 – 28 April, 2016. Come see us at booth 143 in hall 7 to discuss our full line of carrier tape solutions, including high precision tape for bare die, Surftape®, cover tape, reels, as well as moisture barrier bags, desiccants and humidity indicators.

 

 

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